📷 Image: Wikimedia Commons / Prime Minister's Office
Technology
Paras Defence to Build ₹6,200 Crore Semiconductor Packaging Plant in Madhya Pradesh
✍️ The Economic Times
🗓 22 Jul 2026, 12:05 PM
👁 1
Paras Defence's arm will invest ₹6,200 crore to set up a semiconductor packaging facility in Madhya Pradesh, boosting India's domestic chip manufacturing capabilities.
Paras Defence's arm announced a ₹6,200 crore investment to establish a semiconductor packaging facility in Madhya Pradesh. The plant will focus on advanced packaging technologies essential for next‑generation chips.
The facility is planned near the industrial corridor in the state, with an expected production capacity that will support both domestic and export markets. It will create a significant number of skilled jobs and help reduce India’s reliance on imported semiconductor components.
Industry analysts view the move as a step toward strengthening India’s semiconductor ecosystem, aligning with the government’s Make in India and Atmanirbhar Bharat initiatives.
Construction is slated to begin in the coming months, with the plant expected to become operational by 2026.
The facility is planned near the industrial corridor in the state, with an expected production capacity that will support both domestic and export markets. It will create a significant number of skilled jobs and help reduce India’s reliance on imported semiconductor components.
Industry analysts view the move as a step toward strengthening India’s semiconductor ecosystem, aligning with the government’s Make in India and Atmanirbhar Bharat initiatives.
Construction is slated to begin in the coming months, with the plant expected to become operational by 2026.